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Email: info@intelaser.com.cn


Automatic camera module cutting  mounting Equipment

Automatic camera module cutting mounting Equipment

  • category:IC semiconductor industry
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  • Release date:2020-07-30 14:17:05
  • Product Overview
  • Processing advantages
  • Technical Parameters
  • Samples show

Product name: Automatic camera module cutting  mounting Equipment

Product model introduction:

This equipment is suitable for cutting the soft  hard boards of the camera module. This equipment is deeply developed for the camera module industry  fits the development trend of the industry. It effectively increases the output while reducing labor costs to the greatest extent. It is a substitute for the sub-board in  tradition of the camera module industry.



                                 

                                                           



Processing advantages:

a. High precision;

b. High efficiency;   

c. Integration, integration of cutting  attaching functions;  

d. Fully automatic process to avoid manual contact  improve consistency;


Technical Parameters

Laser wavelength  power

UV355/15W

Beam quality

<1.1

Scan range  

100mm*100mm

Galvanometer scanning speed   

 <9000mm/s

Cutting accuracy

 ±0.05mm

Platform repeat positioning accuracy

±0.003mm

cooling method

 Water cooling

Ambient temperature/humidity   

22±2℃/30-60% without condensation

Machine power consumption

<5.0kw

Stand-alone size

 2.4m*1.7m*1.9m     



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181-2621-4961

Shenzhen Inte Laser Technology CO.,Ltd.

Tel:0755-27840048

Email:info@intelaser.com.cn

Add:Add:2F,B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.  

Add:Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.


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