Product name: Single/dual platform picosecond UV cutting equipment (manipulator)
Product introduction: Stable equipment performance, low power consumption, wide range of cutting adaptation products: compact structure, easy to understand software operation, good man-machine interface, equipment with correction system; high precision CCD vision system, high cutting accuracy, Stable performance low maintenance cost; application areas: FPC, camera module, fingerprint module, etc. can be cut.
Processing advantages:
a. It can realize FPC shape, soft hard board opening, PCB sub-board, camera module cutting, to meet the rapid cutting of different thickness different materials;
b. The self-developed software can realize functions such as automatic feeding, automatic cutting, automatic counting, unloading;
c. It can achieve high-quality, high-efficiency processing, cutting without carbonation processing effect;
d. The sealed optical path is stable reliable, the built-in automatic power measurement optimization system can ensure stable power during processing;
e. The software can set any target point, automatically analyze the material expansion contraction to adjust the cutting graphics to achieve high-precision cutting.
Technical Parameters | |
Laser wavelength power | UV355/15W/30W |
Beam quality | <1.1 |
Laser safety Class | Class IV |
Scanning Area | 500mm*500mm |
Galvanometer scanning speed | 1000-3000mm/s |
Cutting speed | ±0.03mm |
Platform Repetition accuracy | ±0.003mm |
cooling Mode | Water cooling |
Operating Temperature Environment | 22±2℃ |
Humidity requirements | 30-60%no condensation |
power consumption | <4.0kw |
Dimensions | 1.8m*1.5m*1.9m |
181-2621-4961
Tel:0755-27840048
Email:info@intelaser.com.cn
Add:Add:2F,B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.
Add:Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.