Contact: Ms. Guo
Tel: 0755-27840048
Fax: 18126214961
http: www.intelaser.com.cn
Website：en.intelaser.com.cn
Email: info@intelaser.com.cn
Product name: Automatic laser wafer marking Equipment
Application field: this type of equipment can be applied to all kinds of Wafer , including Si, Si+Adhesive, Si+glass.
Processing advantages:
This type of equipment could be used for the front the back marking,fast marking speed, high efficiency, small focused spot, can achieve ultra-fine marking, less marking dust,without washing, the equipment can be adapted to 6 inches, 8 inches 12 inches wafer.
Technical Parameters | |
Laser wavelength | 532nm 355nm |
Output power | 15W 10W |
Beam quality | <1.3 |
Laser safety Class | Class IV |
Scanning Area | 290*290mm |
Marking speed | 500 characters/s |
Precision | ±0.05mm |
Platform Repetition Accuracy | ±0.0025mm |
cooling Mode | Water cooling |
Operating Temperature Environment | 22 ±2 ℃ |
power consumption | ＜4.5~6.0kw |
Dimensions | 1.8m*1.7m*1.9m |
181-2621-4961
Tel：0755-27840048
Email：info@intelaser.com.cn
Add：Add:2F，B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.
Add：Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.
